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HomeMy WebLinkAboutFile Documents.124 W Hyman Ave.0051.2019 (26).ARBKPRODUCT DATA SHEET SikaBond®-T100 ALL-IN-ONE HYBRID URETHANE ADHESIVE, MOISTURE VAPOR AND SOUND REDUCTION MEMBRANE PRODUCT DESCRIPTION SikaBond®-T100 is a one component, zero VOC, permanently elastic, super strong, very low permeability, moisture-cure, all-in-one hybrid polyurethane adhesive that offers unlimited moisture protection, crack bridging and sound reduction for full surface wood floor bonding. USES SikaBond®-T100 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T100 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane. CHARACTERISTICS / ADVANTAGES 150% Elongation▪ Bonds up to 3/4" solid and engineered wood▪ Cleans off prefinished floors before and after cure▪ Unlimited subfloor moisture vapor protection▪ No moisture testing required - a dry to touch substrate is the only requirement ▪ ZERO VOC▪ Contains no water, solvent or isocyanates▪ Low moisture vapor permeability▪ Sound protection - meets local IIC and STC requirements ▪ Crack Bridging▪ Very easy to spread▪ Low odor▪ Advanced Hybrid Technology▪ Excellent green grab▪ High elongation▪ Permanently elastic - allows planks to expand and contract without damage to the adhesive ▪ Tenacious Bonding▪ Passes USGBC LEED Version 4▪ ENVIRONMENTAL INFORMATION LEED EQc 4.1 ( 100 g/L limit ) SCAQMD, Rule 1168 ( 100 g/L limit ) passes passes BAAQMD, Reg. 8, Rule 51 ( 120 g/L limit ) LEED v4 ( < 0.5 mg/m3 ) passes passes APPROVALS / STANDARDS Independently tested to - STC 62 (ASTM E-90) and IIC = 67 (ASTM E-492) when used as a sound control membrane at the specified coverage. PRODUCT INFORMATION Chemical Base Hybrid Polymer Packaging 4 gal. (15.14 L) Color Off - white Product Data Sheet SikaBond®-T100 June 2019, Version 01.07 020512010000000039 1 / 5 10/14/2019 Shelf Life 12 months from date of production if stored in undamaged original sealed containers Storage Conditions Keep in dry conditions and protected from direct sunlight at temperatures between 50 °F and 77 °F (10–25 °C) Density 1.64 kg/L Water Vapor Permeability is < 4 g/mmHg, 24h, m2 according to ASTM E-96 (< 4 Perms) Consistency Easy to spread TECHNICAL INFORMATION Shore A Hardness 45–50 (7 days at 74 °F (24 °C) and 50 % R.H.) Tensile Strength 150 psi (1.03 MPa)(7 days at 74 °F (24 °C) and 50 % R.H.) Elongation at Break 150 %(7 days at 74 °F (24 °C) and 50 % R.H.) Shear Strength 2.0 N/mm², 1 mm adhesive thickness (74 °F (24 °C) and 50 % R.H.) Service Temperature -40–150 °F (-40–65 °C) APPLICATION INFORMATION Coverage Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage. ▪ Applicator is responsible for periodic inspection of the trowel to check for excessive wear. Worn trowels must be replaced immediately. ▪ In case of uneven substrates, it may be necessary to use a notched trowel with bigger notches (avert hollow sections). ▪ Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage. ▪ Trowel size is recommended to obtain proper coverage larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing check coverage during installation. ▪ Product Data Sheet SikaBond®-T100 June 2019, Version 01.07 020512010000000039 2 / 5 10/14/2019 P5 trowels should be used at 90° angle, SC+MB trowel or 1/4 in. (6.3 mm) x 1/4 in. (6.3 mm) V-notch at 45° angle to subfloor to get stated coverages. ▪ Substrate Quality: Structurally sound, clean, dry, homogeneous, even, free from grease, dust and loose particles, paint, laitance, and other poorly adhering particles must be removed. ▪ The P5 and SC+MB trowel are available from Sika.▪ Ambient Air Temperature Room temperature between 50 °F (15 °C) and 90 °F (35 °C). For ambient temperatures standard construction guidelines should be followed. Follow all wood floor manufacturers’ acclimation and room temperature requirements. Relative Air Humidity Between 40 % and 70 % during installation is best for adhesive. See wood floor manufacturer for wood requirements. Substrate Temperature During laying and until SikaBond®-T100 has fully cured, substrate temperature should be greater than 60 °F (15 °C) and in the case of radiant floor heating, less than 70 °F (20 °C). For substrate temperatures, standard construction guidelines should be followed. Substrate Moisture Content For use as an adhesive only: SikaBond®-T100 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable per wood manufacturer’s requirements, use SikaBond®-T100 at recommended coverage rate for moisture protection or use Sika® MB. For use as an adhesive and membrane: Concrete must be dry to touch. Inspect for any wetness at base of drywall or visible signs of moisture on concrete. Concrete and cement-based underlayments must be fully cured and free of any hydrostatic and/or moisture problems. When properly applied in accordance with Sika® guidelines, SikaBond®-T100 provides unlimited moisture vapor protection. Curing Rate Floor may accept light foot traffic after: 8 hours Floor can be sanded after 18 hours. Skin Time / Laying Time 60 min 74 °F 50 % R.H. APPLICATION INSTRUCTIONS SUBSTRATE PREPARATION SikaBond®-T100 can be used without priming on properly prepared, structurally sound concrete, cement floors, chipboards, ceramic tiles, plywood and hardwood. Sika® recommends the use of Sika® MB over any dry, gypsum based subflooring to enhance surface strength. Maximum acceptable floor variation is 3/16 in. (4.7 mm) over 10 feet (3 m). Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond. All concrete, cement screed and gypsum based subfloors must be structurally sound, clean, dry, smooth, free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Remove laitance or weak areas mechanically. For application over ceramic tiles it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum. For substrates with old well bonded adhesive or adhesive residue use Sika® MB – see Product Data Sheet for installation instructions and proper details. If surface contains asphalt (cutback) adhesive follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use Sika® MB to help promote adhesion to the subfloor or use a Sika Level system over the cutback residue. SikaBond®-T100 will adhere to Sika® Level levelers and patches as well as most common patching/leveling compounds. For unknown substrates please contact Sika® Technical Services for best practices at 1-800-933- SIKA. APPLICATION METHOD / TOOLS Read and understand data sheet completely before beginning installation. Follow all industry standards, as well as hardwood and bamboo flooring manufacturer’s recommendations for floor flatness, acclimation, design, layout, application, etc. of wood flooring material. If jobsite conditions are outside of flooring manufacturer’s recommendations, take necessary corrective actions as recommended by the floor manufacturer to address these issues. Whether the moisture content of substrate exceeds or is within the manufacturer’s recommendations, to address current or possible future subfloor moisture, apply SikaBond®-T100 as directed. Product Data Sheet SikaBond®-T100 June 2019, Version 01.07 020512010000000039 3 / 5 10/14/2019 SikaBond®-T100 is applied to the properly prepared substrate directly from the pail and uniformly distributed by trowel as described on this Product Data Sheet. Press the wood floor elements firmly into the adhesive so that the wood floor underside is sufficiently wetted. The elements can then be joined together using a rubber hammer and an impact block and/ or rubber mallet. Many types of wood floors have to be tapped from the top. Leave gaps at room perimeters and at any floor wall partition to allow wood flooring to move naturally – follow recommended guidelines from wood floor manufacturer. Spacers should be used to ensure perimeter space is maintained. The wood flooring manufacturer’s laying instructions, acclimation requirements, room humidity/environmental control requirements as well as standard construction rules must be observed. Clean up SikaBond®-T100 cleans easily off of most finishes on pre- finished flooring, even after cure. It is still easier to clean as you go while the adhesive is still wet. Clean with a soft non-abrasive towel as you work. After cure remove adhesive with a non-abrasive towel. Tools that will not damage the floor finish may also work. Clean all tools and equipment immediately after use before adhesive cures. Mineral spirits or other similar solvent can be used. LIMITATIONS Wood size limitations can be found in coverage section▪ P5 trowel or larger must be used with all solid woods and when applying over gypsum based sub floor (for use as an adhesive only) ▪ SC+MB or 1/4 in. (6.3 mm) x 1/4 n. (6.3 mm) trowel must be used for use as an adhesive and vapor retarder membrane. Follow the wood floor manufacturer’s installation instructions. ▪ Periodically check coverage of adhesive during installation: 100 % substrate coverage and adhesive transfer is required to protect against damages from subfloor moisture. ▪ Minimum age of concrete before application is 21–28 days, depending on curing and drying conditions. ▪ Room temperatures should be between 50 °F (10 °C) and 90 °F (32 °C) during installation unless otherwise specified limitations by wood flooring manufacturer. ▪ Do not use on wet, contaminated or friable substrates.▪ When needed, Sika® recommends the use of Sika® Level patching and levelling compounds for best results. ▪ Gypsum based sub-floors are very susceptible to excess moisture and will be degraded if exposed to excess moisture from below or above. ▪ Solid wood and bamboo flooring cannot be used below grade due to their lack of dimensional stability. ▪ Do not use in areas subject to hydrostatic head or in areas subject to secondary source of moisture. ▪ On-or below-grade substrates must have appropriate▪ vapor barrier (< 6 mil, 0.15 mm ) properly installed below slab. Do not use over concrete with curing compounds, sealers or other surface treatments that could im pact the adhesion. ▪ This adhesive will not prevent all possible moisture related or installalation related issues such as im proper acclimation of flooring, jobsite temperature and relative humidity, etc. ▪ This membrane reduces moisture vapor emissions that originate from below the membrane only. ▪ This membrane does NOT reduce issues originating from the ends, sides or top of flooring, i.e. puddles, water leaks, etc. ▪ Sub-floor should be level – do not use adhesive as a levelling agent. ▪ Cutback or other asphaltic based residue must be removed. ▪ Chemically treated woods (ammonia, wood stain, timber preservatives, etc.) and woods with high oil content must be tested for adhesion prior to application. ▪ Adhesive should be kept above 60 °F (15 °C) for best workability. ▪ Sufficient ambient moisture is necessary for proper curing. ▪ When bonding solid wood Sika recommends the use of straps to fully connect tongue and groove – especially when wood pieces are not perfectly straight – ensure starter rows are set and properly cured to handle tension from straps. ▪ Installations over radiant heat require that slab temperature be kept below 70 °F (21 °C) during installation and for 48 hours after installation – then raised slowly up to final desired temperature. Follow wood floor manufacturer’s temperature guidelines. ▪ Do not expose SikaBond®-T100 to alcohol.▪ BASIS OF PRODUCT DATA Results may differ based upon statistical variations depending upon mixing methods and equipment, temperature, application methods, test methods, actual site conditions and curing conditions. OTHER RESTRICTIONS See Legal Disclaimer. ENVIRONMENTAL, HEALTH AND SAFETY For further information and advice regarding transportation, handling, storage and disposal of chemical products, user should refer to the actual Safety Data Sheets containing physical, environmental, toxicological and other safety related data. User must read the current actual Safety Data Sheets before using any products. In case of an emergency, call CHEMTREC at 1-800-424-9300, International 703-527-3887. Product Data Sheet SikaBond®-T100 June 2019, Version 01.07 020512010000000039 4 / 5 10/14/2019 DIRECTIVE 2004/42/CE - LIMITATION OF EMISSIONS OF VOC 0 g/L (measured per SCAQMD rule 1168) LEGAL DISCLAIMER • KEEP CONTAINER TIGHTLY CLOSED • KEEP OUT OF REACH OF CHILDREN • NOT FOR INTERNAL CONSUMPTION • FOR INDUSTRIAL USE ONLY • FOR PROFESSIONAL USE ONLY Prior to each use of any product of Sika Corporation, its subsidiaries or affiliates (“SIKA”), the user must always read and follow the warnings and instructions on the product’s most current product label, Product Data Sheet and Safety Data Sheet which are available at usa.sika.com or by calling SIKA’s Technical Service Department at 1-800-933-7452. Nothing contained in any SIKA literature or materials relieves the user of the obligation to read and follow the warnings and instructions for each SIKA product as set forth in the current product label, Product Data Sheet and Safety Data Sheet prior to use of the SIKA product. SIKA warrants this product for one year from date of installation to be free from manufacturing defects and to meet the technical properties on the current Product Data Sheet if used as directed within the product’s shelf life. User determines suitability of product for intended use and assumes all risks. User’s and/or buyer’s sole remedy shall be limited to the purchase price or replacement of this product exclusive of any labor costs. NO OTHER WARRANTIES EXPRESS OR IMPLIED SHALL APPLY INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. SIKA SHALL NOT BE LIABLE UNDER ANY LEGAL THEORY FOR SPECIAL OR CONSEQUENTIAL DAMAGES. SIKA SHALL NOT BE RESPONSIBLE FOR THE USE OF THIS PRODUCT IN A MANNER TO INFRINGE ON ANY PATENT OR ANY OTHER INTELLECTUAL PROPERTY RIGHTS HELD BY OTHERS. Sale of SIKA products are subject to the Terms and Conditions of Sale which are available at https://usa.sika.com/en/group/SikaCorp/termsandcondi tions.html or by calling 1-800-933-7452. SikaBond-T100-en-US-(06-2019)-1-7.pdf Sika Corporation 201 Polito Avenue Lyndhurst, NJ 07071 Phone: +1-800-933-7452 Fax: +1-201-933-6225 usa.sika.com Sika Mexicana S.A. de C.V. Carretera Libre Celaya Km. 8.5 Fracc. Industrial Balvanera Corregidora, Queretaro C.P. 76920 Phone: 52 442 2385800 Fax: 52 442 2250537 Product Data Sheet SikaBond®-T100 June 2019, Version 01.07 020512010000000039 5 / 5 10/14/2019